System zur Inspektion eines Wafers

Details

Veröffentlichungs-Nr.

EP4776828

Anmeldetag

18. Dezember 2025

Veröffentlichung

15. Juli 2026

Rechtsraum

EP

IPC

H10P72/00, H10P72/76

Abstract

A system (1) for inspecting a wafer (90) having a coating layer is provided. The system (1) includes a main body (11), an optical sensor module (13) and a processing module (14). The main body (11) defines an inspection space (110) where the wafer (90) is to be disposed. The optical sensor module (13) is mounted on the main body (11) and is configured to inspect the wafer (90) so as to obtain a sensing dataset of the wafer (90). The processing module (14) is electrically connected to the optical sensor module (13) and is configured to determine a quality of the coating layer of the wafer (90) based on the sensing dataset.

Anmelder

Firma

Scientech Corporation

Land

🇹🇼 Taiwan

Fachgebiete