Wärmeverwaltungsanordnungen für Gleitanwendungen

Details

Veröffentlichungs-Nr.

EP4776833

Anmeldetag

8. Januar 2026

Veröffentlichung

15. Juli 2026

Rechtsraum

EP

IPC

H10W40/20

Abstract

Exemplary embodiments are disclosed of thermal management assemblies or thermal solutions (e.g., with improved durability, etc.) for sliding applications. In exemplary embodiments, the thermal management assembly or thermal solution is robust and improves heat transfer between a slidable heat source and a stationary heat sink via a durable layer (e.g., metal wear-resistant layer defined by a stainless steel, copper, beryllium copper, aluminum, brass, other metal substrate or cover, other materials with high thermal conductivity and puncture resistant in addition to wear-resistant, etc.) disposed over or along a thermal interface material (broadly, interface material) (e.g., thermal phase change material (PCM), etc.), thereby providing a durable, slide-resistant thermal interface material (TIM) with improved performance over conventional thermal solutions.

Anmelder

Firma

Laird Technologies, Inc.

Land

🇺🇸 USA

Fachgebiete