Halbleiterbauelement und Verfahren dafür

Details

Veröffentlichungs-Nr.

EP4776836

Anmeldetag

20. November 2025

Veröffentlichung

15. Juli 2026

Rechtsraum

EP

Abstract

A method of manufacturing a semiconductor device is provided. The method includes affixing a plurality of semiconductor die on a first major side of a leadframe having a plurality of package sites, each semiconductor die affixed at a respective package site, the leadframe selectively plated such that un-plated regions are formed between the package sites. An encapsulant encapsulates the plurality of semiconductor die and the first major side of the leadframe. A second major side of the leadframe is exposed through the encapsulant. The un-plated regions are etched from the second major side of the leadframe to electrically isolate each package site from one another.

Anmelder

Firma

NXP B.V.

Land

🇳🇱 Niederlande