Verfahren zur Inspektion von Poren und Entlüftungsfehlern für einen Luftdicht Verschlossenen Speicher

Details

Veröffentlichungs-Nr.

EP4779686

Anmeldetag

13. August 2024

Veröffentlichung

20. März 2025

Rechtsraum

EP

IPC

H01L21/673, G01M3/26

Abstract

The present invention is a method for inspecting a pinhole and a degassing failure in a bag body hermetically packaging a sealed storage container, in a state where the sealed storage container storing a semiconductor wafer is hermetically packaged in a degassed state with a resin bag body or an aluminum-vapor-deposited bag body so as to prevent exposure of the sealed storage container to outside air, to inspect presence or absence of the pinhole and presence or absence of the degassing failure in the bag body, the method including the steps of pressurizing, after a predetermined period or longer has elapsed following the hermetic packaging, at least one side surface among side surface portions of the bag body, which hermetically packages the sealed storage container, with a pad, measuring, by employing a sensor provided above an upper end portion of the bag body, which hermetically packages the sealed storage container, a distance between the upper end portion and the sensor in a state pressurized in the step of pressurizing, and determining, based on the distance measured in the step of measuring, the presence or absence of the pinhole and the presence or absence of the degassing failure in the bag body. This provides a method for inspecting, in which a simple method without relying on an inspector enables the determination of the presence or absence of the pinhole and the presence or absence of the degassing failure in the bag body, which hermetically packages the sealed storage container.

Anmelder

Firma

Shin-Etsu Handotai Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete