Wärmeableitungsvorrichtung und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP4780149

Anmeldetag

10. September 2024

Veröffentlichung

20. März 2025

Rechtsraum

EP

IPC

H05K7/20

Abstract

The present invention relates to a heat dissipation device and a manufacturing method therefor. The heat dissipation device according to the present invention includes a heat-conduction panel body in which a refrigerant flow space having a predetermined thickness is formed to dissipate heat through a first surface and a second surface, wherein the heat-conduction panel body comprises a vacuumization portion installed on either the first surface or the second surface to communicate with the refrigerant flow space in a direction perpendicular thereto, the vacuumization portion being configured to vacuumize the refrigerant flow space before a refrigerant is filled into the refrigerant flow space or after the refrigerant is filled therein. Thus, there are the advantages of preventing a refrigerant leak in the heat dissipation device and improving heat dissipation performance.

Anmelder

Firma

KMW Inc.

Land

🇰🇷 Südkorea

Fachgebiete