Verpackungsstruktur, Verpackungsverfahren, Chipstapelstruktur und Elektronische Vorrichtung
Anmelder: Beijing X-Ring Technology Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4780192
- Anmeldetag
- 19. August 2025
- Veröffentlichung
- 22. Juli 2026
- Rechtsraum
- EP
Abstract
The invention relates to a packaging structure, a packaging method, a chip stacking structure and an electronic device. The packaging structure includes a first chip (1) and a second chip (2) stacked with the first chip, and the first chip has a first element (11). An active surface of the second chip is arranged opposite to an active surface of the first chip. The second chip includes a shielding element (21) arranged on one side of the second chip close to the first chip, and the shielding element is configured for reducing signal interference from the second chip to the first element. According to the packaging structure of the invention, the second chip has the shielding element, and the shielding element is arranged on the side of the second chip close to the first chip. The signal interference from the second chip to the first element may be reduced or even avoided by the usage of the shielding element, which improves a signal quality of the first element, thereby improving a signal quality of the packaging structure.
Anmelder
- Firma
- Beijing X-Ring Technology Co., Ltd.
- Land
- 🇨🇳 China
Schoppe, Zimmermann, Stöckeler, Zinkler, Schenk & Partner mbB berät von München aus Unternehmen und Forschungseinrichtungen aus aller Welt, mit technischem Schwerpunkt auf Audio- und Videokodierung, Mobilfunk, künstlicher Intelligenz und Halbleitertechnik.