Schnittstelle zwischen einer Elektronischen Integrierten Schaltung und einer Photonischen Integrierten Schaltung

Details

Veröffentlichungs-Nr.

EP4782898

Anmeldetag

27. Januar 2026

Veröffentlichung

29. Juli 2026

Rechtsraum

EP

IPC

G02B6/42, G02B6/43, H10W90/00

Abstract

An example integrated circuit (IC) assembly can include a first electrical integrated circuit (EIC) electrically and mechanically coupled to a substrate and including a first and a second die-to-die interface circuit. The IC assembly can include a first optical transceiver engine electrically and mechanically coupled to the substrate and including a third and a fourth die-to-die interface circuit. The IC assembly can include a second optical transceiver engine electrically and mechanically coupled to the substrate and including a fifth and a sixth die-to-die interface circuit. The third die-to-die interface circuit can be electrically coupled to the first die-to-die interface circuit by first conductors of the substrate. The fifth die-to-die interface circuit can be electrically coupled to the second die-to-die interface circuit by second conductors of the substrate. The fourth and the sixth die-to-die interface circuits can be configured as disconnected from power supplies of the first and second optical transceiver engines, respectively.

Anmelder

Firma

Avago Technologies International Sales Pte. Limited

Land

🇸🇬 Singapur

Fachgebiete