Substratverarbeitungssystem, Verbindungsvorrichtung und Verbindungsverfahren

Details

Veröffentlichungs-Nr.

EP4783225

Anmeldetag

13. September 2024

Veröffentlichung

3. April 2025

Rechtsraum

EP

Abstract

A substrate processing system includes a bonding apparatus bonding substrates together; and control circuitry. The bonding apparatus includes: a first holder holding a first substrate; a second holder disposed below or above the first holder, and holding a second substrate; a contact member bringing a center of the first substrate and a center of the second substrate into contact with each other; an imaging device imaging at least the first substrate; and a moving mechanism moving the first holder, the second holder, and the imaging device relative to one another. The first substrate has at least one reference point, coordinates of which are known with the center of the first substrate as an origin. The control circuitry executes a control including: (a) a process of imaging the first substrate to determine a virtual center of the first substrate; (b) a process of moving an imaging center of the imaging device from the virtual center to a position corresponding to the coordinates of the reference point when the virtual center is set as an origin; (c) a process of imaging the first substrate at the position to which the imaging center has been moved in the process (b) to obtain a coordinate difference between the imaging center and the reference point; (d) a process of correcting the virtual center to obtain the center of the first substrate; and (e) a process of bringing the center of the first substrate obtained in the process (d) into contact with the center of the second substrate.

Anmelder

Firma

Tokyo Electron Limited

Land

🇯🇵 Japan