Verbindungssystem und Verbindungsverfahren

Details

Veröffentlichungs-Nr.

EP4783226

Anmeldetag

17. September 2024

Veröffentlichung

3. April 2025

Rechtsraum

EP

IPC

H01L21/02, H01L21/677

Abstract

A bonding system includes a first transfer device 61, a surface modifying apparatus 33, a load lock chamber 31, a transfer chamber 32, a substrate processing apparatus 34, and a bonding apparatus 41. The first transfer device transfers a first substrate W1 and a second substrate W2. The surface modifying apparatus 33 modifies surfaces of the first substrate W1 and the second substrate W2. An interior of the load lock chamber 31 is allowed to be switched between an atmospheric-pressure atmosphere and the reduced-pressure atmosphere. In the transfer chamber 32, a second transfer device 32a transferring the first substrate W1 and the second substrate W2 between the load lock chamber 31 and the surface modifying apparatus 33 is disposed. The surface modifying apparatus 33 includes a first gas supply 122 and a first switching device 126. The first gas supply 122 supplies multiple types of gases into the surface modifying apparatus 33. The first switching device 126 switches a type of gas supplied into the surface modifying apparatus 33. Furthermore, the transfer chamber 32 includes a second gas supply 130 and a second switching device 136. The second gas supply 130 supplies multiple types of gases into the transfer chamber 32. The second switching device 136 switches a type of gas supplied into the transfer chamber 32.

Anmelder

Firma

Tokyo Electron Limited

Land

🇯🇵 Japan

Fachgebiete