Substratverarbeitungsvorrichtung und Substratverarbeitungsverfahren
Anmelder: SCREEN Holdings Co., Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4783227
- Anmeldetag
- 27. Mai 2024
- Veröffentlichung
- 27. März 2025
- Rechtsraum
- EP
Abstract
A technique disclosed in the specification of the present application is a technique of suppressing damage on an electrolysis cell in substrate processing. A substrate processing apparatus according to a technique disclosed in the specification of the present application includes a substrate processing part, a supply tank, a generation part, a collection part, a first supply route supplying a processing solution generated in the generation part to the supply tank, and a second supply route supplying the processing solution generated in the generation part to the collection part, and the collection part supplies a treated solution with which the processing solution supplied through the second supply route has been mixed to the generation part.
Anmelder
- Firma
- SCREEN Holdings Co., Ltd.
- Land
- 🇯🇵 Japan
Japanischer Technologiekonzern. SCREEN Holdings stellt Fertigungsanlagen für die Halbleiterindustrie her, insbesondere Wafer-Reinigungs- und Beschichtungssysteme, sowie Druck- und Bildverarbeitungstechnik.
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