Hilfsheizvorrichtung und Halbleiterwärmebehandlungsvorrichtung

Details

Veröffentlichungs-Nr.

EP4783232

Anmeldetag

11. Oktober 2024

Veröffentlichung

1. Mai 2025

Rechtsraum

EP

Abstract

The present disclosure provides an auxiliary heating apparatus and a semiconductor heat treatment equipment. The auxiliary heating apparatus includes: a housing, which is capable of being disposed inside a semiconductor heat treatment equipment at a position near a process door during use, and is provided with a mounting cavity; a heating element, which is disposed in the mounting cavity; a cable, which is connected to the heating element, and is configured to be connected to a power supply; and a connector, a first end of the connector being connected to the housing, a second end of the connector being capable of extending out of the semiconductor heat treatment equipment during use, the connector being provided with a wiring channel communicating with the mounting cavity, and the cable being capable of extending out of the semiconductor heat treatment equipment through the wiring channel during use. The auxiliary heating apparatus provided in the present disclosure can increase the number of product wafers processed by a single machine and improve process quality of product wafers.

Anmelder

Firma

Beijing NAURA Microelectronics Equipment Co., Ltd.

Land

🇨🇳 China