Wärmeableitungsstruktur für ein Halbleitergehäusemodul und Elektronische Vorrichtung damit
EP4783752
29. Juli 2026
Anmelder: Unick Corporation 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4783752
- Anmeldetag
- 19. Januar 2026
- Veröffentlichung
- 29. Juli 2026
- Rechtsraum
- EP
Abstract
The present disclosure relates to a heat dissipation structure for a semiconductor package module capable of more effectively dissipating heat generated by a semiconductor device, and an electronic device including the same, in which circuit patterns are provided on at least one surface of a substrate, a semiconductor device is mounted on one surface of the substrate on which the circuit patterns are provided, and a heat dissipation trace for dissipating heat generated by the semiconductor device is formed on the substrate.
Anmelder
- Firma
- Unick Corporation
- Land
- 🇰🇷 Südkorea
Vertreten von
-
Zacco Sweden AB
Zacco Sweden AB · Stockholm