Übertragung von Hochfrequenzsignalen durch einen Interposer
Anmelder: NXP USA, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4783817
- Anmeldetag
- 12. Januar 2026
- Veröffentlichung
- 29. Juli 2026
- Rechtsraum
- EP
Abstract
An integrated circuit assembly includes first and second circuit portions, an interposer vertically disposed between the first and second circuit portions, the interposer having a plated through hole with a metallic sidewall, and a metallic pillar that extends through the plated through hole without touching the metallic sidewall. The metallic pillar and the plated through hole together form a vertical coaxial structure constructed and arranged to convey RF (radio frequency) signals between the first and second circuit portions. Embodiments are directed to both the integrated circuit assembly and to a method of manufacturing the integrated circuit assembly.
Anmelder
- Firma
- NXP USA, Inc.
- Land
- 🇺🇸 USA
US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.
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