Verpackungsstruktur für eine Oberflächenmontage, Leistungsmodul mit einer Vielzahl von Elektronischen Halbleiterbauelementen

Details

Veröffentlichungs-Nr.

EP4783820

Anmeldetag

28. Januar 2026

Veröffentlichung

29. Juli 2026

Rechtsraum

EP

IPC

H10W70/65, H10W90/00

Abstract

A power module (30) has a multilayer support (50) forming a dissipating plate (49) and conductive islands (55, 56). A first die (51A) has a lower face coupled to the first island (55) and a second die (51B) has a lower face coupled to the second island (56). A package (31) encapsulates the support (30), the first and the second dice (51A, 51B), with the dissipating plate (49) formed in an opening of a lower main surface (32A) of the package (31) and flush therewith. A first power pin (36) protrudes from a first side surface (32A) of the package and is coupled to a first pad (61) of the first die (51A). A second power pin (38) protrudes from a second side surface (32B) of the package and is coupled to a first pad (61) of the second die (51B). A saddle element (70) extends at a distance over the first die (51A) and is formed by a power terminal (47) flush with an upper main surface (33A) of the package (31) and by legs (72) extending from the power terminal and bonded to the first island (55).

Anmelder

Firmen

STMicroelectronics International N.V.
Shenzhen STS Microelectronics Co., Ltd.

Land

🇨🇭 Schweiz

Fachgebiete