Mikrofluidisches Kühlsystem

Details

Veröffentlichungs-Nr.

EP4786050

Anmeldetag

31. Januar 2025

Veröffentlichung

5. August 2026

Rechtsraum

EP

IPC

B01L3/00

Abstract

A microfluidic device (100) comprising: a monolithic semiconductor substrate (10) with thermal conductivity ks; one or more heaters (20) on its top surface, each with a heating element (21); a thermal insulation layer (40) between the heaters (20) and the substrate (10), with thermal conductivity ki at least 50 times smaller than ks; and one or more liquid cooling units (30) with cooling fins (31) on the substrate's bottom surface. Each fin (31) has an extremity (32) within 100 µm of a heating element (21). A cover (60) encloses the cooling units (30), forming cooling channels (61) and including inlet (62) and outlet (63) ports for liquid circulation.

Anmelder

Firma

Imec VZW

Land

🇧🇪 Belgien

Fachgebiete