Polierverfahren und Poliervorrichtung

Details

Veröffentlichungs-Nr.

EP4786097

Anmeldetag

28. Januar 2026

Veröffentlichung

5. August 2026

Rechtsraum

EP

Abstract

A polishing method capable of improving flatness of a bonding surface for forming a laminated substrate is disclosed. The polishing method includes: measuring a shape of a periphery of a substrate having the bonding surface for forming the laminated substrate, the bonding surface including a surface of a device region and a surface of a dielectric film formed on the periphery and raised from the device region; determining a polishing recipe including a change in a movement speed of a polishing head from a polishing start position to a polishing end position based on the measured shape of the periphery; and polishing the dielectric film to planarize the bonding surface by pressing, by the polishing head, a polishing tool against the periphery of the substrate being rotated while the polishing head is moved in a radial direction of the substrate according to the determined polishing recipe.

Anmelder

Firma

EBARA CORPORATION

Land

🇯🇵 Japan