Stromlose Kupferplattierungsablagerung, Stromloses Kupferplattierungsbad und Verfahren zur Herstellung einer Stromlosen Kupferplattierungsablagerung
EP4786638
5. August 2026
Anmelder: C. Uyemura & Co., Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4786638
- Anmeldetag
- 2. Februar 2026
- Veröffentlichung
- 5. August 2026
- Rechtsraum
- EP
Abstract
Provided are an electroless copper plating deposit that allows a metal oxide layer to exhibit good peel strength to a glass or ceramic material, and an electroless copper plating bath and a method of producing an electroless copper plating deposit, which are capable of producing the electroless copper plating deposit. Included is an electroless copper plating deposit which is formed on a metal oxide layer formed on a surface of a glass or ceramic material and which has a combined amount of nickel, cobalt, gold, silver, platinum, bismuth, antimony, tungsten, ruthenium, rhodium, lead, tellurium, iron, manganese, titanium, and vanadium that is 0.1% by mass or more.
Anmelder
- Firma
- C. Uyemura & Co., Ltd.
- Land
- 🇯🇵 Japan