Verfahren zum Verbinden von Chips mit Wafern

Details

Veröffentlichungs-Nr.

EP4787074

Anmeldetag

3. Februar 2025

Veröffentlichung

5. August 2026

Rechtsraum

EP

IPC

G03F7/00, G03F9/00

Abstract

There is provided a method of determining a correction for at least one first substrate and/or a second substrate, the correction being defined across an exposure field on at least one first substrate, wherein the exposure field comprises multiple sub-field portions, wherein each sub-field portion is to be bonded to a second substrate to obtain a bonded substrate in a bonding process, the method comprising: obtaining a first component of parameter of interest data relating to a parameter of interest which is common to each sub-field portion of the said multiple sub-field portions; and determining the correction based on suppression of the first component for each sub-field portion of the multiple sub-field portions.

Anmelder

Firma

ASML Netherlands B.V.

Land

🇳🇱 Niederlande

Fachgebiete