Verfahren zum Verbinden von Halbleitersubstraten
Anmelder: ASML Netherlands B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4787431
- Anmeldetag
- 3. Februar 2025
- Veröffentlichung
- 5. August 2026
- Rechtsraum
- EP
Abstract
The present disclosure relates to a method of bonding a first semiconductor substrate and a second semiconductor substrate. The method may comprise clamping the first semiconductor substrate to a clamp such that the first semiconductor substrate is supported by a plurality of support protrusions on the clamp. The method may further comprise, applying a force to the first semiconductor substrate to initiate the bonding of the first semiconductor substrate and the second semiconductor substrate. The force may be generated by, or transmitted by, the plurality of support protrusions on the clamp. The applying of the force to the first semiconductor substrate to initiate the bonding of the first semiconductor substrate and the second semiconductor substrate may simultaneously initiate a plurality of bond fronts.
Anmelder
- Firma
- ASML Netherlands B.V.
- Land
- 🇳🇱 Niederlande
Niederländisches Unternehmen, das Lithografiesysteme und weitere Anlagen für die Halbleiterfertigung entwickelt und herstellt, zentral für die Chipindustrie.
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ASML Netherlands B.V
ASML Netherlands B.V · Veldhoven