Stufe zur Chipplatzierung
Anmelder: ASML Netherlands B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4790745
- Anmeldetag
- 11. Februar 2025
- Veröffentlichung
- 12. August 2026
- Rechtsraum
- EP
Abstract
A stage for die placement comprises: a support member; a movable member that is movable relative to the support member, wherein the movable member is configured to hold at least one die; and an actuator configured, on actuation, to move the movable member relative to the support member so as to flip the die and move the die along a die path to place the die on an acceptor substrate, wherein the stage is arranged such that the die path extends further in a direction perpendicular to a plane of the acceptor substrate than in a direction parallel to the plane of the acceptor substrate.
Anmelder
- Firma
- ASML Netherlands B.V.
- Land
- 🇳🇱 Niederlande
Niederländisches Unternehmen, das Lithografiesysteme und weitere Anlagen für die Halbleiterfertigung entwickelt und herstellt, zentral für die Chipindustrie.
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Vertreten von
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ASML Netherlands B.V
ASML Netherlands B.V · Veldhoven