Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
Anmelder: SK hynix Inc. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4791142
- Anmeldetag
- 5. Dezember 2025
- Veröffentlichung
- 12. August 2026
- Rechtsraum
- EP
Abstract
A semiconductor device includes a gate structure including insulating layers and conductive layers alternately stacked, channel structures (120) extending through the gate structure and arranged in a first direction (I) and a second direction (II) crossing the first direction, a slit structure (130) extending in the first direction and including a body portion (130A) and protrusions (130B) protruding from the body portion in the second direction, and dummy structures (140) arranged in the first direction between the channel structures and the slit structure and respectively contacting the protrusions.
Anmelder
- Firma
- SK hynix Inc.
- Land
- 🇰🇷 Südkorea
Südkoreanischer Halbleiterhersteller, der Speicherchips wie DRAM und NAND-Flash für Computer, Server und mobile Geräte produziert.
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