Bildaufnahmevorrichtung
Anmelder: SK hynix Inc. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4791151
- Anmeldetag
- 29. Oktober 2025
- Veröffentlichung
- 12. August 2026
- Rechtsraum
- EP
- IPC
- H10F39/00
Abstract
An image sensing device includes a substrate including a first surface and a second surface opposite to the first surface; a first well region including impurities of a first conductivity type and disposed in the substrate to be in contact with the second surface; a second well region including impurities of a second conductivity type opposite to the first conductivity type and disposed in the substrate to be in contact with the first well region; a first interconnect electrically connected to the first well region through a first contact plug; a second interconnect electrically connected to the second well region through a second contact plug; and a field-dispersion electrode connected to a third interconnect through a third contact plug and disposed to cover an edge region of the second well region between the first contact plug and the second contact plug.
Anmelder
- Firma
- SK hynix Inc.
- Land
- 🇰🇷 Südkorea
Südkoreanischer Halbleiterhersteller, der Speicherchips wie DRAM und NAND-Flash für Computer, Server und mobile Geräte produziert.
136 Patente in unserer Datenbank
Fachgebiete
Vertreten von
-
Isarpatent
Isarpatent · München