Mikroelektromechanische Vorrichtung und Verfahren

Details

Veröffentlichungs-Nr.

EP4793222

Anmeldetag

17. Februar 2025

Veröffentlichung

19. August 2026

Rechtsraum

EP

IPC

B81B7/00

Abstract

A microelectromechanical device comprises a MEMS device layer a handle layer and a cap layer. The device also comprises an interposer layer between the handle layer and the MEMS device layer. The interposer layer comprises an insulating layer on the surface of the handle layer and a polysilicon layer on the insulating layer. The device layer comprises a mobile mass element. The polysilicon layer lies beneath the mass element and is electrically connected to a first external contact in the cap layer through the device layer.

Anmelder

Firma

Murata Manufacturing Co., Ltd.

Land

🇯🇵 Japan