Mems-Vorrichtung mit einer Kappe und einer Signalverarbeitungsschaltung mit Geringen Abmessungen und Herstellungsverfahren dafür
Anmelder: STMicroelectronics International N.V. 🇨🇭
Details
- Veröffentlichungs-Nr.
- EP4796493
- Anmeldetag
- 6. Februar 2026
- Veröffentlichung
- 26. August 2026
- Rechtsraum
- EP
- IPC
- B81C1/00
Abstract
Microelectromechanical -MEMS- device (35) formed by a first substrate (1'), having a first and a second main face (35A, 1B) and accommodating integrated electrical components (10) and external connection vias (33) extending through the first substrate (1'); a second substrate (2'), having a first and a second main face (2A, 25B) and accommodating conductive vias (17) extending between the first and second main surfaces of the second substrate, the first main face (25B) of the second substrate (2') coupled to the second main face (1B) of the first substrate (1') and the conductive vias (17) coupled to the external connection vias (33); and a third substrate (3'), having a main face (3A) and accommodating MEMS structures (19), the main face (3A) of the third substrate (3') coupled to the second main face (25B) of the second substrate (2'). The conductive vias (17) and the external connection vias (33) electrically couple the first face (35A) of the first substrate (1') to the MEMS structures (19).
Anmelder
- Firma
- STMicroelectronics International N.V.
- Land
- 🇨🇭 Schweiz
Schweizer Gesellschaft des Halbleiterkonzerns STMicroelectronics, die Chips und Sensoren für Automobiltechnik, Industrie und Unterhaltungselektronik entwickelt.
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