Substratverarbeitungsvorrichtung

Details

Veröffentlichungs-Nr.

EP4797318

Anmeldetag

3. Oktober 2024

Veröffentlichung

24. April 2025

Rechtsraum

EP

IPC

H01L21/3063

Abstract

A substrate processing apparatus (1) includes a substrate holder that holds a substrate (9) having a first main surface (91) and a second main surface (92) and having a peripheral edge portion (93) on which a metal film (96) is provided on the first main surface side, an electrode unit (5) that includes a first electrode (51) and a second electrode (52) and in which, when etching is performed, the first electrode is located in the vicinity of the peripheral edge portion on the first main surface side, and the second electrode is separated from the first electrode and located in the vicinity of the substrate, a processing-liquid filling unit (6) that fills gaps between the substrate and each of the first and second electrodes with a processing liquid (L1), a power source (50) that applies a voltage between the first electrode and the second electrode to allow etching, a rotation mechanism that rotates the substrate relative to the electrode unit, and an auxiliary fluid nozzle (81) that, when etching is performed, jets out an auxiliary fluid radially outward to the peripheral edge portion on the second main surface side of the substrate.

Anmelder

Firma

SCREEN Holdings Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete