Substratverarbeitungsvorrichtung

Details

Veröffentlichungs-Nr.

EP4797319

Anmeldetag

3. Oktober 2024

Veröffentlichung

24. April 2025

Rechtsraum

EP

IPC

H01L21/3063

Abstract

A substrate processing apparatus (1) includes a substrate holder that holds a substrate (9) having a peripheral edge portion (93) on which a metal film (96) is provided on the side of a first main surface (91), an electrode unit (5) that includes a first electrode (51) and a second electrode (52) and in which, when etching is performed, the first electrode is located in the vicinity of the peripheral edge portion on the side of the first main surface, and the second electrode is separated from the first electrode and located in the vicinity of the substrate, a processing-liquid filling unit (6) that fills gaps between the substrate and each of the first and second electrodes with a processing liquid (L1), a power source (50) that applies a voltage between the electrodes to allow etching of a portion of the metal film that is located in the vicinity of the first electrode, and a rotation mechanism that rotates the substrate relative to the electrode unit. The first electrode has a side face including an interest region (516) that has repellency to the processing liquid, the interest region facing radially inward and located in the vicinity of the first main surface.

Anmelder

Firma

SCREEN Holdings Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete