Oberflächenmontierbarer Wärmeableiter zur Wärmeableitung von einem Wärmeerzeugenden Bauelement auf einer Leiterplatte

Details

Veröffentlichungs-Nr.

EP4797882

Anmeldetag

19. Februar 2025

Veröffentlichung

26. August 2026

Rechtsraum

EP

IPC

H05K1/02, H01L23/367

Abstract

A surface mountable heat dissipator configured to be in thermal contact with a designated heat generating component such as a transistor on a printed circuit board the heat dissipator is formed by a strip of sheet metal bent into a loop, two ends of the bent strip of sheet metal are joined to render the loop a closed loop a mounting portion of the bent strip of sheet metal is substantially flat, and is configured to be surface mounted. A closed loop of relatively thin metal gives the heat dissipator satisfactory mechanical stability with a relatively small amount of material, thereby reducing manufacturing costs and mass. The low mass ensures that only a low amount of force is exerted upon the heat dissipator and its solder joins when it is subject to external shocks and vibrations. This increases robustness and lifetime of the overall product implementing the heat dissipator.

Anmelder

Firma

ICEpower a/s

Land

🇩🇰 Dänemark

Fachgebiete