Herstellungsverfahren für Gehäuse, Gehäuse und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4797887

Anmeldetag

5. August 2024

Veröffentlichung

19. Juni 2025

Rechtsraum

EP

IPC

H05K5/02

Abstract

This application provides a preparation method for a housing, a housing, and an electronic device. The preparation method for a housing includes: providing a metal cast, where the metal cast includes a metal matrix and a metal outer layer, the metal outer layer is located on an outer side of the metal matrix and is adjacent to the metal matrix, and a hole is formed in the metal outer layer; and performing thermal deformation and forging on a part of the metal outer layer that is away from the metal matrix to obtain a metal dense layer. A housing obtained by using the preparation method does not need a filler material, and surface consistency of the housing is good.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China

Fachgebiete