Dreidimensionale (3D) Thermische Verbindungen mit Rheologiegesteuerten Thermischen Grenzflächenmaterialien (tims)

Details

Veröffentlichungs-Nr.

EP4797932

Anmeldetag

20. Februar 2026

Veröffentlichung

26. August 2026

Rechtsraum

EP

IPC

H10W40/25, C09K5/10, C09K5/12

Abstract

Disclosed are exemplary methods for forming three-dimensional (3D) thermal joints using thermal interface materials (TIMs), e.g., metal amalgams, low melting alloys, liquid metals, rheology controlled TIMs, etc. Also disclosed are exemplary embodiments of three-dimensional (3D) thermal joints including TIMs, e.g., metal amalgams, low melting alloys, liquid metals, rheology controlled TIMs, etc. The 3D thermal joint may be used to fill in gap(s) between a heat source(s) and another component(s) of an electronic device. For example, the 3D thermal joint may be used to fill in the gaps between multiple heat sources of varying heights (e.g., integrated circuit (IC) components of varying heights, 2D processor, 2.5D processor, 3D processor, chiplet segmented processor, other component(s) having multiple heights, etc.) and a heat removal/dissipation component (e.g., a heat sink, a heat spreader, a heat pipe, a vapor chamber, a water block, a device exterior case, a housing, a chassis, etc.).

Anmelder

Firma

Laird Technologies, Inc.

Land

🇺🇸 USA

Fachgebiete