Wärmerohr, Halbleiterbauelement mit Wärmerohr und Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP4797934

Anmeldetag

11. Februar 2026

Veröffentlichung

26. August 2026

Rechtsraum

EP

Abstract

Semiconductor devices and methods of manufacturing the semiconductor devices are provided. For example, a semiconductor device (1) may include: a stack of semiconductor layers including a first semiconductor layer (200B), and a second semiconductor layer (200C) stacked on the first semiconductor layer (200B) in a first direction (Z); a heat sink (300) stacked on the second semiconductor layer (200C) in the first direction (Z); and a heat pipe (100) that extends in the first semiconductor layer (200B), the second semiconductor layer (200C), and the heat sink (300) in the first direction (Z).

Anmelder

Firma

Samsung Electronics Co., Ltd.

Land

🇰🇷 Südkorea