Verfahren und Vorrichtung zur Kompensation von Impedanz und zur Reduzierung von Übersprechen in Gehäusen Integrierter Schaltungen

Details

Veröffentlichungs-Nr.

EP4797938

Anmeldetag

18. Dezember 2025

Veröffentlichung

26. August 2026

Rechtsraum

EP

Abstract

Systems, apparatus, articles of manufacture, and methods to compensate for impedance and reduce crosstalk in integrated circuit packages are disclosed. An example apparatus includes a metal interconnect within a substrate of an integrated circuit package. The metal interconnect includes a contact pad in a first metal layer of the substrate and a via pad in a second metal layer of the substrate. The metal interconnect defines a conductive path for an electric signal that is to pass through both the contact pad and the via pad. The example apparatus further includes a conductive material having a length defining a segment of the conductive path between the contact pad and the via pad. At least a portion of the length of the conductive material extends along a course that corresponds and is adjacent to a portion of a perimeter of the contact pad.

Anmelder

Firma

Intel Corporation

Land

🇺🇸 USA