Verpackte Vorrichtung, Verfahren zur Herstellung und Leiterrahmen

Details

Veröffentlichungs-Nr.

EP4801251

Anmeldetag

3. Februar 2026

Veröffentlichung

2. September 2026

Rechtsraum

EP

Abstract

A packaged device includes a substrate, a die, a die flag, and a plurality of leads. The substrate has a lower surface and an upper surface opposite the lower surface. The die is arranged on the upper surface of the substrate. The die has a lower surface facing the upper surface of the substrate, and an upper surface opposite the lower surface. The die flag includes a cover portion which is arranged over the upper surface of the die. The cover portion has a lower surface and an upper surface opposite the lower surface. The lower surface of the cover portion faces the upper surface of the die. The plurality of leads is arranged around a periphery of the substrate. The plurality of leads includes a first lead connected to the die flag, and a second lead separated from the die flag. Each of the plurality of leads includes an outer portion which has a lower surface and an upper surface opposite the lower surface. The lower surfaces of the plurality of leads are coplanar with and separated from the lower surface of the substrate.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA