Herstellungsverfahren für Eingebettete Leiterplatte

Details

Veröffentlichungs-Nr.

EP4804737

Anmeldetag

2. Februar 2026

Veröffentlichung

9. September 2026

Rechtsraum

EP

IPC

H05K1/185, H05K3/00

Abstract

The present disclosure provides a production method of an embedded circuit board, including: forming a base hole at a substrate, the base hole being used for accommodating a chip; positioning the substrate and the chip using a fixing member, and laminating the substrate and the chip onto a first layer plate; removing the fixing member; providing an acid cleaning chamber and a plasma cleaning chamber that are formed as an integrated structure, transferring the chip and the substrate to a lifting device, driving the chip and the substrate to rise into the plasma cleaning chamber through the lifting device, and performing plasma cleaning on the chip and the substrate; driving the chip and the substrate to descend into the acid cleaning chamber through the lifting device, driving a water spray assembly in the acid cleaning chamber to move to a position above the chip and the substrate, and uniformly spraying acid cleaning solution onto the chip and the substrate; taking out the chip and the substrate; laminating the substrate and the chip onto a second layer plate, the first layer plate and the second plate being located at two opposite sides of the chip; and forming a circuit on the first layer plate and the second layer plate, and welding/soldering components. The present disclosure can improve production efficiency.

Anmelder

Firma

Olympic Circuit Technology Co., Ltd.

Land

🇨🇳 China

Fachgebiete