Substratverarbeitungsverfahren und Substratverarbeitungsvorrichtung

Details

Veröffentlichungs-Nr.

EP4808336

Anmeldetag

5. Januar 2026

Veröffentlichung

16. September 2026

Rechtsraum

EP

IPC

H10P72/00

Abstract

The present invention relates to a substrate processing method and a substrate processing apparatus. The substrate processing method includes a treating step, a replacing step, and a pressure restoration step. In the treating step, a treating gas is supplied to a treatment space. The treatment space accommodates a substrate. In the replacing step, a pressure in the treatment space is kept lower than atmospheric pressure. In the replacing step, an inert gas is supplied to the treatment space. In the replacing step, a gaseous body is exhausted from the treatment space. In the pressure restoration step, the pressure in the treatment space returns to the atmospheric pressure. A flow rate of the inert gas supplied to the treatment space is a supply flow rate. A flow rate of the gaseous body exhausted from the treatment space is an exhaust flow rate. In the replacing step, at least either the supply flow rate or the exhaust flow rate changes with time.

Anmelder

Firma

SCREEN Holdings Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete