Chip zur Verzugssteuerung in Halbleitergehäusen
Anmelder: Avago Technologies International Sales Pte. Limited 🇸🇬
Details
- Veröffentlichungs-Nr.
- EP4808342
- Anmeldetag
- 3. März 2026
- Veröffentlichung
- 16. September 2026
- Rechtsraum
- EP
Abstract
The subject technology is directed to semiconductor devices and fabrication methods thereof. In an embodiment, the subject technology provides an apparatus that includes a functional die coupled to a first side of a substrate and a second die coupled to a second side of the substrate opposite the first side. The second die is at least one of (1) about a same thickness as the first die, (2) about a same area as the first die, (3) in about a same location as the first die, or (4) formed from a similar material as the first die. Providing the second die on the second side of the substrate counterbalances the thermomechanical stresses or forces produced by the first die. Thus, reducing the stresses on the substrate than can cause misalignment between semiconductor components or electrical failures. There are other embodiments as well.
Anmelder
- Firma
- Avago Technologies International Sales Pte. Limited
- Land
- 🇸🇬 Singapur
Singapurische Vertriebsgesellschaft des Halbleiterkonzerns Avago Technologies (heute Broadcom), tätig im internationalen Vertrieb von Halbleiterkomponenten für Kommunikations-, Industrie- und Speicheranwendungen.
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