Bauelement mit einem Speicherstapel und Wärmeübertragungsschichten über einem Basis-Chip

Details

Veröffentlichungs-Nr.

EP4808343

Anmeldetag

18. Dezember 2025

Veröffentlichung

16. September 2026

Rechtsraum

EP

Abstract

Technologies for thermal management of the base die in high-bandwidth memory (HBM) die stacks are disclosed. In an illustrative embodiment, the interface logic region of the base die is a hot spot, as all of the high-speed signals into and out of the HBM die stack pass through the interface logic region. The memory dies stacked above the base die may not extend all the way across the HBM die stack, leaving space above the interface logic region of the base die. A stack of one or more heat transfer layers can be deposited on the base die above the interface logic region, removing heat and conducting it up to the top of the HBM die stack, where a heat sink or integrated heat spreader may be. The stack of one or more heat transfer layers may be any suitable material, such as silicon, dielectric packaging mold, etc.

Anmelder

Firma

Intel Corporation

Land

🇺🇸 USA