Wärmepumpe

Details

Veröffentlichungs-Nr.

EP4810871

Anmeldetag

18. März 2026

Veröffentlichung

23. September 2026

Rechtsraum

EP

Abstract

A heat pump of the present invention includes a water inlet pipe assembly which comprises a water inlet pipe, and through which water flows in from the outside; a pump which circulates the water flowed in from the water inlet pipe assembly; a heat exchanger which exchanges heat of the water circulated from the pump with a refrigerant; and a water outlet pipe assembly through which the heat-exchanged water flows out, wherein the water inlet pipe is made of a plastic material.

Anmelder

Firma

LG Electronics Inc.

Land

🇰🇷 Südkorea