Pellikel

Details

Veröffentlichungs-Nr.

EP4811035

Anmeldetag

21. März 2025

Veröffentlichung

23. September 2026

Rechtsraum

EP

IPC

G03F1/62, G03F7/00

Abstract

A pellicle for an apparatus for semiconductor processes comprising: a pellicle film; a border forming at least part of a support layer for supporting the pellicle film; and a sacrificial layer; wherein the sacrificial layer is disposed between and directly contacts the pellicle film and the support layer. Also described is an apparatus for semiconductor processes comprising such a pellicle. In addition, there is provided method of manufacturing a pellicle for an exposure apparatus for semiconductor manufacturing processes, the method comprising: depositing an sacrificial layer on a front side of a silicon support layer; applying a mask to define border regions at a back side of the silicon support layer; and depositing a metal silicide layer directly onto the sacrificial layer.

Anmelder

Firma

ASML Netherlands B.V.

Land

🇳🇱 Niederlande

Fachgebiete