Verfahren zum Bonden von Substraten und Vorrichtung zum Bonden von Substraten

Details

Veröffentlichungs-Nr.

EP4811423

Anmeldetag

17. März 2025

Veröffentlichung

23. September 2026

Rechtsraum

EP

IPC

H01L21/67

Abstract

The present disclosure relates to a method of bonding a first substrate to a second substrate. The method may comprise, while bringing a bonding surface of the first substrate into contact with a bonding surface of the second substrate, driving at least one vibrational mode of the first substrate to modify a speed of propagation of a bond front. The present disclosure also relates to another method of bonding a first substrate and a second substrate. The method may comprise, while bringing a bonding surface of the first substrate into contact with a bonding surface of the second substrate, generating a wave configured to interact with a bond front to modify a speed of propagation of the bond front. The present disclosure also relates to other, related methods, and apparatuses for performing the methods.

Anmelder

Firma

ASML Netherlands B.V.

Land

🇳🇱 Niederlande

Fachgebiete