Kointegration von Luftbrücken und 3D-Integrationsmodulen

Details

Veröffentlichungs-Nr.

EP4811996

Anmeldetag

20. März 2025

Veröffentlichung

23. September 2026

Rechtsraum

EP

Abstract

A method for fabricating one or more airbridge structures and one or more 3D integration modules on a patterned metallization layer of a wafer comprising qubits or superconducting electronics, the method comprising: providing the wafer with the patterned metallization layer; depositing an integrated metallization layer, either before or after providing and patterning a first resist layer; forming one or more airbridge structures which are contacting the patterned metallization layer at openings in the first resist layer, wherein the one or more airbridge structures are made of a superconductive material at operating temperatures; and fabricating 3D integration modules by electroplating predefined regions of the integrated metallization layer.

Anmelder

Firma

Imec VZW

Land

🇧🇪 Belgien