Substratverarbeitungsvorrichtung, Substratverarbeitungsverfahren, Verfahren zur Herstellung eines Halbleiterbauelements und Programm

Details

Veröffentlichungs-Nr.

EP4812002

Anmeldetag

16. März 2026

Veröffentlichung

23. September 2026

Rechtsraum

EP

IPC

H10P72/10, H10P72/30

Abstract

A technique includes: a first mounter on which a first container capable of accommodating a substrate is mounted; a second mounter on which a second container capable of accommodating the substrate is mounted; a first supply system configured to supply a substance X to the second container; a transfer apparatus configured to be capable of transferring the substrate between the first container and the second container; a process container configured to process the substrate; and a controller configured to be capable of controlling the first supply system and the transfer apparatus so as to perform: (a) transferring the substrate from the first container to the second container; (b) supplying the substance X to the substrate accommodated in the second container; and (c) after (b), transferring the substrate on which the substance X is adsorbed from the second container to the process container.

Anmelder

Firma

Kokusai Electric Corporation

Land

🇯🇵 Japan

Fachgebiete