Verkapselte Elektronische Vorrichtung mit einer Horizontalen Kontaktkonfigurationskomponente und einer Vertikalen Kontaktkonfigurationskomponente

Details

Veröffentlichungs-Nr.

EP4812008

Anmeldetag

17. März 2026

Veröffentlichung

23. September 2026

Rechtsraum

EP

Abstract

Packaged electronic device having a first and a second dice arranged between a first and a second support element (75, 76) formed by multilayers. The first die (60) has a first and a second contact region (64, 64) on its first main face (60A). The second die (61) has a first contact region (69) on its first main face (61A) and a second contact region (71) on its second main face (61B). The dice (60, 61) are bonded with their first face (60A, 61A) to the second support element (76) and with their second face (60B, 61B) to the first support element (75). The first support element (75) forms a conductive interconnection region (80) electrically coupled to the first contact region (69) of the second die (61). The second support element (76) forms a plurality of islands, including a first island (89G) coupled to the first contact region (64) of the first die (60) through an internal portion (87G) of a first connection element (88G); a second island (89D) coupled to the first contact region (69) of the second die (61) through the internal portion (87D) of a second connection element (88D). A third connection element (88C) couples the second contact region (65) of the first die (60) to the interconnection region (80).

Anmelder

Firma

STMicroelectronics International N.V.

Land

🇨🇭 Schweiz