Halbleitergehäuse mit einem Umverteilungssubstrat

Details

Veröffentlichungs-Nr.

EP4812010

Anmeldetag

6. Februar 2026

Veröffentlichung

23. September 2026

Rechtsraum

EP

Abstract

A semiconductor package according to embodiments of the present disclosure includes a package substrate; a redistribution substrate bonded to the package substrate by a first bump, and including a dielectric layer and redistribution patterns; a first underfill layer filled in the space between the package substrate and the redistribution substrate; a semiconductor chip bonded to the redistribution substrate by a second bump; and a first molding layer disposed on the redistribution substrate, and surrounding the semiconductor chip, wherein the dielectric layer includes a negative tone dielectric layer that includes polyimide at a mass ratio of 50% or more.

Anmelder

Firma

SK hynix Inc.

Land

🇰🇷 Südkorea