Mikroelektronische Anordnungen mit Luftspaltbezugspunkten

Details

Veröffentlichungs-Nr.

EP4812011

Anmeldetag

17. Dezember 2025

Veröffentlichung

23. September 2026

Rechtsraum

EP

IPC

H10W80/00

Abstract

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first microelectronic component having a first bonding layer with a first air gap fiducial; and a second microelectronic component having a second bonding layer with a second air gap fiducial, wherein the first microelectronic component is coupled to the second microelectronic component by the first and second bonding layers, and wherein the first air gap fiducial and the second air gap fiducial are aligned.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA

Fachgebiete