Zellenhalbleiterbauelementstruktur mit Fusionierter Höhe und Verfahren zur Formung davon
Anmelder: Samsung Electronics Co., Ltd. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4814778
- Anmeldetag
- 23. März 2026
- Veröffentlichung
- 30. September 2026
- Rechtsraum
- EP
- IPC
- G06F30/392
Abstract
A semiconductor cell architecture is disclosed including a merged-height cell (310), also known as a hyper or booster cell, having a cell height, CH, approximately one-and-one-half times that of a base unit cell (308) (1.5×CH). The base unit cell (308) follows a P/N/P/N vertical placement, while the merged-height cell (310) follows a P/N/N/P configuration. The merged-height cell (310) is vertically offset by about one-quarter cell height (0.25×CH) such that the nanosheet centers of NFET and PFET active regions in the merged-height cell (310) align with those in the base unit cell (308). This alignment allows direct abutment between base and merged-height cells (308, 310) without dummy filler regions, maintaining process limits on active-region jogs. The 1.5×CH architecture increases effective channel width (Weff) and drivability with reduced area penalty compared to conventional 2×CH merged-height cells (310). The merged-height cell architecture enables merged-height standard-cell libraries for sub-3 nm nodes, improving performance, area efficiency, and routing compatibility in advanced integrated-circuit design.
Anmelder
- Firma
- Samsung Electronics Co., Ltd.
- Land
- 🇰🇷 Südkorea
Südkoreanischer Elektronikkonzern und Teil der Samsung-Gruppe. Entwickelt und produziert Halbleiter, Speicherchips, Displays, Smartphones, Unterhaltungselektronik sowie Haushaltsgeräte für den globalen Markt.
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