Komponententräger und Verfahren zur Herstellung eines Komponententrägers

Details

Veröffentlichungs-Nr.

EP4815645

Anmeldetag

26. März 2025

Veröffentlichung

30. September 2026

Rechtsraum

EP

Abstract

The present invention relates to a component carrier (100) a method for manufacturing thereof, wherein the component carrier (100) comprises a stack (110) comprising a plurality of electrically conductive layer structures (104) and at least two inorganic layer structures (106). Additionally, the component carrier (100) comprises a connection structure (160) configured for connecting the at least two inorganic layer structures (106), said connection structure (160) comprising metallic nanostructures and/or microstructures (165) configured for connecting at least two of the plurality of electrically conductive layer structures (104). Furthermore, the present invention relates to a component carrier (100), wherein the component carrier (100) comprises a stack (110) comprising at least one electrically conductive layer structure (104) and at least one inorganic layer structure (106). Additionally, the component carrier (100) comprises a connection structure (160) provided on one surface of the at least one inorganic layer structure (106), said connection structure (160) comprising a material comprising a volatile portion, wherein said at least one inorganic layer structure comprises at least one venting hole (130) connected on the surface of the at least one inorganic layer structure (106) where the connection structure (160) is provided.

Anmelder

Firma

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Land

🇦🇹 Österreich