Donatello, Daniele

The present invention relates to a component carrier (100) a method for manufacturing thereof, wherein the component carrier (100) comprises a stack (110) comprising a plurality of electrically conductive layer structures (104) and at least two inorganic layer structures (106). Additionally, the component carrier (100) comprises a connection structure (160) configured for connecting the at least two inorganic layer structures (106), said connection structure (160) comprising metallic nanostructures and/or microstructures (165) configured for connecting at least two of the plurality of electrically conductive layer structures (104). Furthermore, the present invention relates to a component carrier (100), wherein the component carrier (100) comprises a stack (110) comprising at least one electrically conductive layer structure (104) and at least one inorganic layer structure (106). Additionally, the component carrier (100) comprises a connection structure (160) provided on one surface of the at least one inorganic layer structure (106), said connection structure (160) comprising a material comprising a volatile portion, wherein said at least one inorganic layer structure comprises at least one venting hole (130) connected on the surface of the at least one inorganic layer structure (106) where the connection structure (160) is provided.

The invention relates to a component carrier (1) comprising a stack (2) with at least one electrically conductive layer structure (3) and a plurality of electrically insulating layer structures (4,5), wherein at least one first electrically insulating layer structure (4) is provided at a first main side (6) of the stack (2) and at least one second electrically insulating layer structure (5) is provided at an opposed second main side (7) of the stack (2). At least one component (8) is embedded in the at least one first electrically insulating layer structure (4); wherein at least one counter-element (9) is embedded in the at least one second electrically insulating layer structure (5), wherein said at least one counter-element (9) is configured and positioned to affect the stack (2) in opposition of the embedded component (8).

The present invention relates to a component carrier (100), a method for manufacturing thereof and to a component carrier assembly comprising a component carrier (100), wherein the component carrier (100) comprises a flexible stack (10) and at least two further stacks (20, 30, 40), wherein a first further stack (30) and the second further stack (40) each are electrically connected to the flexible stack (10) by an electrical connection (33, 43) comprising electrically conductive paste, wherein each of said stacks (10, 20, 30, 40) comprises a stacking direction (Z1, Z2, Z3, Z4) and at least one lateral surface (14, 15; 24, 25; 34, 35; 44, 45) limiting the extension of said stack (10, 20, 30, 40) in planar direction (P) perpendicular to its stacking direction (Z1, Z2, Z3, Z4), wherein at least one lateral surface (14, 15) of the flexible stack (10) and at least one lateral surface (34, 35; 44, 45) of one of the at least two further stacks (30, 40), each facing towards a same lateral side of the component carrier (100, 200, 300, 400, 500, 600, 700, 800), are extending in different spatial planes.

The present invention relates to a component carrier (100) a method for manufacturing thereof, wherein the component carrier (100) comprises a stack (110) comprising at least one electrically conductive layer structure (104) and a plurality electrically insulating layer structures (102), said stack (110) comprising a cavity (130). A component (140) is embedded in the cavity (130) and at least one further layer portion (120) is partially filling the cavity (130). The space between the cavity (130) and component (140) and/or the at least one further layer portion (120) is filled by resin (150) flowed from one of the plurality of electrically insulating layer structures and/or from the at least one further layer portion.

There is described a component carrier (100) having a stack (101), wherein the stack (101) comprises:i) at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (102, 140);ii) an inorganic layer structure (110) with a, in particular planar, main surface (111);iii) a cavity (120) in the stack (101), defined by a bottom (121) and a sidewall (122); andiv) at least one stop layer (130), arranged at least partially in or on the main surface (111) of the inorganic layer structure (110) and exposed at the bottom (121) of the cavity (120). The present application further provides a method of manufacturing a component carrier (100).

The present invention relates to a component carrier (100) a method for manufacturing thereof, wherein the component carrier (100) comprises a stack (110) comprising a plurality of electrically conductive layer structures (104) and a plurality of electrically insulating layer structures (102). Said stack (110) further comprises a cavity (120) having a bottom wall (122) composed of a plurality of portions (124) having a respective vertical level, and being delimited by one main surface of one of said plurality of electrically conductive layer structures (104) or electrically insulating layer structures (102) composing the stack (110). Additionally, the component carrier (100) comprises a plurality of components (130) provided in said cavity (120), at least two of said components (130) having different heights one to each other and each of said components (130) being associated to one respective portion (124), such that the surfaces of said components (130) opposed to the bottom wall (122) of the cavity (120) are vertically positioned within the vertical extension of the same external layer structures Further additionally, the component carrier (100) comprises an encapsulant material (140) embedding said plurality of components (130).

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