Drucksensorvorrichtung, Drucksensorsystem und Verfahren zur Herstellung der Drucksensorvorrichtung

EP4818661 7. Oktober 2026

Anmelder: NXP USA, Inc. 🇺🇸

Details

Veröffentlichungs-Nr.
EP4818661
Anmeldetag
3. April 2025
Veröffentlichung
7. Oktober 2026
Rechtsraum
EP
IPC
G01L9/12, G01L9/00
Offizieller Volltext

Abstract

The present disclosure relates to a sensor device comprising a sensor substrate, a sensor capacitor, a first sensor contact element, and a second sensor contact element, wherein the sensor capacitor is arranged on a surface, referred to as the first top surface, of the sensor substrate, wherein the sensor capacitor comprises a first sensor electrode and a second sensor electrode, wherein the second sensor electrode is arranged between the first sensor electrode and the first top surface of the sensor substrate such that a sensor cavity is provided between the two sensor electrodes, wherein both sensor contact elements are arranged on another surface, referred to as the first bottom surface, of the sensor substrate, wherein a first electrical interconnection extends through the sensor substrate from the first sensor electrode to the first sensor contact element, and wherein a second electrical interconnection extends through the sensor substrate from the second sensor electrode to the second sensor contact element.

Anmelder

Firma
NXP USA, Inc.
Land
🇺🇸 USA
🇺🇸 NXP USA

US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.

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