Systeme mit Zweichip-Ic-Gehäusen und Homogen Ausgerichteten Speicherverbindern sowie Zugehörige Verfahren

Details

Veröffentlichungs-Nr.

EP4818914

Anmeldetag

25. März 2026

Veröffentlichung

7. Oktober 2026

Rechtsraum

EP

IPC

G06F13/16, // G11C5/04

Abstract

A two-die integrated circuit (IC) package is coupled to dual in-line memory module (DIMM) connectors. The DIMM connectors are homogeneously-oriented (e.g., in a same direction) but the dies on the IC package are oriented opposite to each other. The DIMM connectors are homogeneously oriented to avoid issues with memory card insertion and to minimize DIMM connector density. Because the DIMM connectors are coupled to both of the dies on the IC package, and the dies are oriented opposite to each other, the sub-channels of the physical interfaces (PHYs) on a second die of the two dies is oriented opposite to the sub-channel interfaces in the DIMM connectors. The second die directs memory transactions of a first sub-channel through a second sub-channel interface driver in the PHY and the other die directs memory transactions of a first sub-channel of the memory through a first sub-channel interface driver in the PHY.

Anmelder

Firma

Microsoft Technology Licensing, LLC

Land

🇺🇸 USA

Fachgebiete