Speichervorrichtung und Betriebsverfahren dafür
Anmelder: Samsung Electronics Co., Ltd. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4819137
- Anmeldetag
- 17. März 2026
- Veröffentlichung
- 7. Oktober 2026
- Rechtsraum
- EP
- IPC
- G11C7/12, G11C11/4091
Abstract
Provided is a memory device including a first sense amplification circuit (42) connected to a first input and output line pair (LIO, LIOB), a pre-charge circuit (44) connected to a second input and output line pair (GIO, GIOB), and a first switch circuit (43), wherein the pre-charge circuit (44) is configured to pre-charge the second input and output line pair (GIO, GIOB) at a pre-charge voltage after the first switch circuit (43) disconnects the first input and output line pair (LIO, LIOB) from the second input and output line pair (GIO, GIOB), and wherein the first switch circuit (43) is configured to connect the first input and output line pair (LIO, LIOB) and the second input and output line pair (GIO, GIOB) to deliver a voltage of the first input and output line pair (LIO, LIOB), which is amplified by the first sense amplification circuit (42), to the pre-charged second input and output line pair (GIO, GIOB) in a read operation.
Anmelder
- Firma
- Samsung Electronics Co., Ltd.
- Land
- 🇰🇷 Südkorea
Südkoreanischer Elektronikkonzern und Teil der Samsung-Gruppe. Entwickelt und produziert Halbleiter, Speicherchips, Displays, Smartphones, Unterhaltungselektronik sowie Haushaltsgeräte für den globalen Markt.
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